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商品詳細
Electronic Materials Innovations and Reliability in Advanced Memory Packaging.
・ISBN 978-3-031-94797-1 paper EUR 159.99
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| 著者・編者 | Gan, Chong Leong / Huang, Chen Yu, |
|---|---|
| シリーズ | (Springer Series in Reliability Engineering) |
| 出版社 | (Springer International Publishing AG, SZ) |
| 出版年月 | 2026 |
| ページ数 | 178 pp. |
| 言語 | ENG |
| ニュース番号 | ＜A05-94338＞ |
解説
This book provides a comprehensive introduction the reliability, and electronic materials innovations in advanced memory device packaging from component to system level. Special features of this book are sections covering not only the advanced packaging materials, but also system level packaging and integration in memory modules and solid state drives (SSD).
The book is an extremely useful and applicable guide to professionals and students on materials reliability in memory device packaging - from component to system level.