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Introduction to Microelectronics Advanced Packaging Assurance.

Introduction to Microelectronics Advanced Packaging Assurance.

・ISBN 978-3-031-86104-8 paper EUR 49.99

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お気に入り
著者・編者Asadizanjani, Navid / Reddy Kottur?, Himanandhan / Dalir, Hamed,
シリーズ (Synthesis Lectures on Engineering, Science, and Technology)
出版社 (Springer International Publishing AG, SZ)
出版年月2026
ページ数183 pp.
言語ENG
ニュース番号<A05-82087>

解説

This book offers a comprehensive introduction and in-depth information on all the packaging technologies and fabrication methodologies employed in advanced semiconductor packaging. Coverage includes materials, substrates, and assembly processes, as well as critical areas of testing and reliability, which are crucial for ensuring the utmost quality and reliability of advanced packaging solutions.