株式会社極東書店トップ ＞ 商品一覧 ＞ Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments. 2nd edition
商品詳細
Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments. 2nd edition
・ISBN 978-1-041-21691-9 hard GB£ 103.99
￥32,943.- (税込) ※（※）価格はご注文時の参考価格となります。
納品価格につきましては書籍の入荷時点で確定となります。
版元の原価改定、外国為替の変動等により異なる場合がございますので、予めご了承下さい。
| 著者・編者 | Cepeda-Rizo, Juan / Gayle, Jeremiah / Ravich, Joshua, |
|---|---|
| シリーズ | (Resilience and Sustainability in Civil, Mechanical, Aerospace and Manufacturing Engineering Systems) |
| 出版社 | (CRC Press, UK) |
| 出版年月 | 2026 |
| ページ数 | 304 pp. |
| 言語 | ENG |
| ニュース番号 | ＜A05-79560＞ |
解説
Suitable for practicing professionals as well as upper-level students in the areas of aerospace, mechanical, thermal, electrical, and systems engineering, Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments provides cutting-edge information on how to design, analyze, and test in the fast-paced and low-cost small satellite environment. It also presents techniques to reduce the design and test cycles without compromising reliability. Further, the book serves both as a reference and a training manual for designing satellites to withstand the structural and thermal challenges of extreme environments in outer space. It provides useful and practical approaches to solving the most complex thermal-structural problems ever attempted for designing spacecraft to survive the severe cold of deep space, as well as the unforgiving temperature swings on the surface of Mars.
-
Provides updates throughout and includes an all-new chapter on Reliability.
-
Includes case studies from NASA's Jet Propulsion Laboratory, which prides itself in robotic exploration of the solar system, as well as flying the first CubeSat to Mars.
-
Examines innovative low-cost thermal and power systems.
-
Explains how to design to survive rocket launch, as well as the surfaces of Mars and Venus.