商品詳細

Advanced semiconductor packaging and heterogeneous integration have become a critical area to enable semiconductor devices with high performance, high functional density, high reliability, and low cost. Advancement in semiconductor packaging technology, in turn, depends critically on innovative materials for miniaturization and high I/O density, signal integrity, power integrity, thermal integrity, reliability, as well as manufacturing quality and cost. Sustainability, another important consideration for semiconductor and microelectronics devices and for the industry as a whole, also depends directly on innovative materials solutions.

This book offers a comprehensive review of the key topics and the latest advancements in innovative materials for advanced semiconductor packaging and heterogeneous integration. Chapter 1 is an overview of semiconductor packaging technologies, outlining the role of materials in various packaging configurations and heterogeneous integration solutions. Chapter 2 reviews substrate and interposer materials (organic, glass, and ceramic) and printed circuit boards. Chapter 3 discusses innovative solder materials for miniaturized interconnects, and Chapter 4 focuses on materials for flexible electronics. Chapter 5 covers materials for thermal management, which is critical for high-performance semiconductor devices, and Chapter 6 covers materials for encapsulation, including underfill, molding compound, conformal coating, etc. Chapter 7 discusses how materials can affect the reliability of semiconductor packaging - particularly for AI and HPC applications, and Chapter 8 provides an overview of materials analysis and testing methodologies and techniques.

This book is aimed at academic and industry researchers as well as industry practitioners. It covers fundamental aspects as well as practical considerations, and it serves as a comprehensive source of the most up-to-date knowledge and a review of the state of the art of the technology and applications for innovative materials for advanced semiconductor packaging and heterogeneous integration.