株式会社極東書店トップ商品一覧Advances in Artificial Intelligence, Electronic Instruments and Information Systems: Proceedings of AIEIIS 2025, Volume 2.

商品詳細

Advances in Artificial Intelligence, Electronic Instruments and Information Systems: Proceedings of AIEIIS 2025, Volume 2.

Advances in Artificial Intelligence, Electronic Instruments and Information Systems: Proceedings of AIEIIS 2025, Volume 2.

・ISBN 978-3-032-23711-8 hard EUR 249.99

¥66,821.- (税込) (※)価格はご注文時の参考価格となります。
納品価格につきましては書籍の入荷時点で確定となります。
版元の原価改定、外国為替の変動等により異なる場合がございますので、予めご了承下さい。

お気に入り
著者・編者Chen, Chien-Ming / Simic, Milan / Hu, Jia / Lip Yee, Por (eds.),
シリーズ (Smart Innovation, Systems and Technologies)
出版社 (Springer Nature Switzerland AG, SZ)
出版年月2026
ページ数326 pp.
言語ENG
ニュース番号<A05-62900>

解説

This book is a compilation of high-quality scientific papers presented at International Conference on Artificial Intelligence, Electronic Instruments and Information Systems (AIEIIS 2025). This book addresses the integration challenge: AI is rapidly evolving, but practical deployment requires seamless interaction with physical devices, embedded systems, and secure information infrastructures. The proceedings emphasize end-to-end solutions, showing how advanced algorithms can be embedded into real-world sensing, measurement, and control platforms. Contributors highlight how AI methods adapt under hardware constraints, achieve energy efficiency, handle uncertainty, and meet requirements of robustness, explainability, and regulatory compliance. The volume is structured to balance theoretical advances with case studies and system prototypes. Part I covers foundations and methods for intelligent sensing, representation, and optimization. Part II presents platforms and architectures, including edge AI, distributed systems, and digital twin frameworks. Part III focuses on security, privacy, and reliability, reflecting the pressing demand for trustworthy AI in sensitive domains. Part IV illustrates application domains such as healthcare instrumentation, intelligent transportation, robotics, industrial inspection, environmental monitoring, and urban computing.