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Copper Electrodeposition for Nanofabrication of Electronics Devices. Softcover reprint of the original 1st ed. 2014
・ISBN 978-1-4939-5373-8 paper EUR 79.99
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| 著者・編者 | Kondo, Kazuo / Akolkar, Rohan N. / Barkey, Dale P. / Yokoi, Masayuki (eds.), |
|---|---|
| シリーズ | (Nanostructure Science and Technology) |
| 出版社 | (Springer-Verlag New York Inc., US) |
| 出版年月 | 2016 |
| ページ数 | 282 pp. |
| 言語 | ENG |
| ニュース番号 | ＜A05-57222＞ |
解説
This book discusses the scientific mechanism of copper electrodeposition and it's wide range of applications. The book will cover everything from the basic fundamentals to practical applications. In addition, the book will also cover important topics such as: * ULSI wiring material based upon copper nanowiring * Printed circuit boards * Stacked semiconductors * Through Silicon Via * Smooth copper foil for Lithium-Ion battery electrodes. This book is ideal for nanotechnologists, industry professionals, and practitioners.