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商品詳細
Thermal Contact Conductance. 2nd ed. 2014
・ISBN 978-3-319-01275-9 hard EUR 99.99
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お気に入り
★★★
| 著者・編者 | Madhusudana, Chakravarti V., |
|---|---|
| シリーズ | (Mechanical Engineering Series) |
| 出版社 | (Springer International Publishing AG, SZ) |
| 出版年月 | 2013 |
| ページ数 | 260 pp. |
| 言語 | ENG |
| ニュース番号 | ＜A05-53543＞ |
解説
The work covers both theoretical and practical aspects of thermal contact conductance. The theoretical discussion focuses on heat transfer through spots, joints, and surfaces, as well as the role of interstitial materials (both planned and inadvertent). The practical discussion includes formulae and data that can be used in designing heat-transfer equipment for a variety of joints, including special geometries and configurations. All of the material has been updated to reflect the latest advances in the field.