株式会社極東書店トップ ＞ 商品一覧 ＞ RF and Microwave Microelectronics Packaging. 2010 ed.
商品詳細
RF and Microwave Microelectronics Packaging. 2010 ed.
・ISBN 978-1-4899-8324-4 paper EUR 149.99
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| 著者・編者 | Kuang, Ken / Kim, Franklin / Cahill, Sean S. (eds.), |
|---|---|
| 出版社 | (Springer-Verlag New York Inc., US) |
| 出版年月 | 2014 |
| ページ数 | 285 pp. |
| 言語 | ENG |
| ニュース番号 | ＜A05-51573＞ |
解説
RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.