株式会社極東書店トップ商品一覧Molecular Modeling and Multiscaling Issues for Electronic Material Applications: Volume 2. Softcover reprint of the original 1st ed. 2015

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Molecular Modeling and Multiscaling Issues for Electronic Material Applications: Volume 2. Softcover reprint of the original 1st ed. 2015

Molecular Modeling and Multiscaling Issues for Electronic Material Applications: Volume 2. Softcover reprint of the original 1st ed. 2015

・ISBN 978-3-319-36666-1 paper EUR 99.99

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お気に入り
著者・編者Wymyslowski, Artur / Iwamoto, Nancy / Yuen, Matthew / Fan, Haibo (eds.),
出版社 (Springer International Publishing AG, SZ)
出版年月2016
ページ数194 pp.
言語ENG
ニュース番号<A05-48954>

解説

This book offers readers a snapshot of the progression of molecular modeling in the electronics industry and how molecular modeling is currently being used to understand materials to solve relevant issues in this field. The reader is introduced to the evolving role of molecular modeling, especially seen from the perspective of the IEEE community and modeling in electronics. This book also covers the aspects of molecular modeling needed to understand the relationship between structures and mechanical performance of materials. The authors also discuss the transitional topic of multiscale modeling and recent developments on the atomistic scale and current attempts to reach the submicron scale, as well as the role that quantum mechanics can play in performance prediction.