株式会社極東書店トップ ＞ 商品一覧 ＞ Benefiting from Thermal and Mechanical Simulation in Micro-Electronics. Softcover reprint of the original 1st ed. 2000
商品詳細
Benefiting from Thermal and Mechanical Simulation in Micro-Electronics. Softcover reprint of the original 1st ed. 2000
・ISBN 978-1-4419-4873-1 paper EUR 99.99
￥26,726.- (税込) ※（※）価格はご注文時の参考価格となります。
納品価格につきましては書籍の入荷時点で確定となります。
版元の原価改定、外国為替の変動等により異なる場合がございますので、予めご了承下さい。
お気に入り
★★★
| 著者・編者 | Zhang, G.Q. / Ernst, L.J. / de Saint Leger, O. (eds.), |
|---|---|
| 出版社 | (Springer-Verlag New York Inc., US) |
| 出版年月 | 2010 |
| ページ数 | 192 pp. |
| 言語 | ENG |
| ニュース番号 | ＜A05-44742＞ |
解説
Benefiting from Thermal and Mechanical Simulation in Micro-Electronics presents papers from the first international conference on this topic, EuroSimE2000. For the first time, people from the electronics industry, research institutes, software companies and universities joined together to discuss present and possible future thermal and mechanical related problems and challenges in micro-electronics; the state-of-the-art methodologies for thermal & mechanical simulation and optimization of micro-electronics; and the perspectives of future simulation and optimization methodology development.
Main areas covered are:- The impact of simulation on industry profitability Approaches to simulation The state-of-the-art methodologies of simulation Design optimization by simulation GBP/LISTGBP Benefiting from Thermal and Mechanical Simulation in Micro-Electronics is suitable for students at graduate level and beyond, and for researchers, designers and specialists in the fields of microelectronics and mechanics.
Main areas covered are:-