株式会社極東書店トップ商品一覧Electrical Conductive Adhesives with Nanotechnologies. 2010 ed.

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Electrical Conductive Adhesives with Nanotechnologies. 2010 ed.

Electrical Conductive Adhesives with Nanotechnologies. 2010 ed.

・ISBN 978-0-387-88782-1 hard

お気に入り
著者・編者Li, Yi (Grace) / Lu, Daniel / Wong, C.P.,
出版社 (Springer-Verlag New York Inc., US)
出版年月2009
ページ数437 pp.
言語ENG
ニュース番号<A05-44285>

解説

"Electrical Conductive Adhesives with Nanotechnologies" begins with an overview of electronic packaging and discusses the various adhesives options currently available, including lead-free solder and ECAs (Electrically Conductive Adhesives). The material presented focuses on the three ECA categories specifically, Isotropically Conductive Adhesives (ICAs) Anisotropically Conductive Adhesives/Films (ACA/ACF) and Nonconductive Adhesives/Films (NCA/NCF). Discussing the advantages and limitations of each technique, and how each technique is currently applied. Lastly, a detailed presentation of how nano techniques can be applied to conductive adhesives is discussed, including recent research and development of nano component adhesives/nano component films, their electrical properties, thermal performance, bonding pressure and assembly and reliability.