株式会社極東書店トップ ＞ 商品一覧 ＞ Design for High Performance, Low Power, and Reliable 3D Integrated Circuits. 2013 ed.
商品詳細
Design for High Performance, Low Power, and Reliable 3D Integrated Circuits. 2013 ed.
・ISBN 978-1-4899-8696-2 paper EUR 109.99
￥29,399.- (税込) ※（※）価格はご注文時の参考価格となります。
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お気に入り
★★★
| 著者・編者 | Lim, Sung Kyu, |
|---|---|
| 出版社 | (Springer-Verlag New York Inc., US) |
| 出版年月 | 2014 |
| ページ数 | 560 pp. |
| 言語 | ENG |
| ニュース番号 | ＜A05-42621＞ |
解説
This book provides readers with a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimensional integrated circuits. It describes numerous "manufacturing-ready" GDSII-level layouts of TSV-based 3D ICs developed with the tools covered in the book. This book will also feature sign-off level analysis of timing, power, signal integrity, and thermal analysis for 3D IC designs. Full details of the related algorithms will be provided so that the readers will be able not only to grasp the core mechanics of the physical design tools, but also to be able to reproduce and improve upon the results themselves. This book will also offer various design-for-manufacturability (DFM), design-for-reliability (DFR), and design-for-testability (DFT) techniques that are considered critical to the physical design process.