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Materials for Advanced Packaging. 2009 ed.
・ISBN 978-0-387-78218-8 hard EUR 199.99
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| 著者・編者 | Lu, Daniel / Wong, C.P. (eds.), |
|---|---|
| 出版社 | (Springer-Verlag New York Inc., US) |
| 出版年月 | 2008 |
| ページ数 | 724 pp. |
| 言語 | ENG |
| ニュース番号 | ＜A05-34049＞ |
解説
Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. This book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.