株式会社極東書店トップ ＞ 商品一覧 ＞ Arbitrary Modeling of TSVs for 3D Integrated Circuits. Softcover reprint of the original 1st ed. 2015
商品詳細
Arbitrary Modeling of TSVs for 3D Integrated Circuits. Softcover reprint of the original 1st ed. 2015
・ISBN 978-3-319-37497-0 paper EUR 99.99
￥26,726.- (税込) ※（※）価格はご注文時の参考価格となります。
納品価格につきましては書籍の入荷時点で確定となります。
版元の原価改定、外国為替の変動等により異なる場合がございますので、予めご了承下さい。
お気に入り
★★★
| 著者・編者 | Salah, Khaled / Ismail, Yehea / El-Rouby, Alaa, |
|---|---|
| シリーズ | (Analog Circuits and Signal Processing) |
| 出版社 | (Springer International Publishing AG, SZ) |
| 出版年月 | 2016 |
| ページ数 | 179 pp. |
| 言語 | ENG |
| ニュース番号 | ＜A05-28412＞ |
解説
This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor and inductive-based communication system and bandpass filtering.