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Arbitrary Modeling of TSVs for 3D Integrated Circuits.
・ISBN 978-3-319-07610-2 hard EUR 99.99
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| 著者・編者 | Salah, Khaled / Ismail, Yehea / El-Rouby, Alaa, |
|---|---|
| シリーズ | (Analog Circuits and Signal Processing) |
| 出版社 | (Springer International Publishing AG, SZ) |
| 出版年月 | 2014 |
| ページ数 | 179 pp. |
| 言語 | ENG |
| ニュース番号 | ＜A05-28019＞ |
解説
This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor and inductive-based communication system and bandpass filtering.