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Failure Analysis of Integrated Circuits: Tools and Techniques. Softcover reprint of the original 1st ed. 1999
・ISBN 978-1-4613-7231-8 paper EUR 149.99
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お気に入り
★★★
| 著者・編者 | Wagner, Lawrence C. (ed.), |
|---|---|
| シリーズ | (The Springer International Series in Engineering and Computer Science) |
| 出版社 | (Springer-Verlag New York Inc., US) |
| 出版年月 | 2012 |
| ページ数 | 255 pp. |
| 言語 | ENG |
| ニュース番号 | ＜A04-81148＞ |
解説
Failure Analysis of Integrated Circuits: Tools and Techniques provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits. These include applications specific to performing failure analysis such as decapsulation, deprocessing, and fail site isolation, as well as physical and chemical analysis tools and techniques. The coverage is qualitative, and it provides a general understanding for making intelligent tool choices. Also included is coverage of the shortcomings, limitations, and strengths of each technique.
Failure Analysis of Integrated Circuits: Tools and Techniques is a `must have' reference work for semiconductor professionals and researchers.
Failure Analysis of Integrated Circuits: Tools and Techniques is a `must have' reference work for semiconductor professionals and researchers.