株式会社極東書店トップ商品一覧Interconnect Technology and Design for Gigascale Integration. Softcover reprint of the original 1st ed. 2003

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Interconnect Technology and Design for Gigascale Integration. Softcover reprint of the original 1st ed. 2003

Interconnect Technology and Design for Gigascale Integration. Softcover reprint of the original 1st ed. 2003

・ISBN 978-1-4613-5088-0 paper EUR 149.99

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お気に入り
著者・編者Davis, Jeffrey A. / Meindl, James D. (eds.),
出版社 (Springer-Verlag New York Inc., US)
出版年月2012
ページ数411 pp.
言語ENG
ニュース番号<A04-78275>

解説

Interconnect Technology and Design for Gigascale Integration is the cumulative effort from academic researchers at Georgia Tech, MIT, and Stanford, as well as from industry researchers at IBM T.J. Watson Research Center, LSI Logic, and SUN microsystems. The material found in this book is unique in that it spans IC interconnect topics ranging from IBM's revolutionary copper process to an in depth exploration into interconnect-aware computer architectures. This broad swath of topics presented by leaders in the research field is intended to provide a comprehensive perspective on interconnect technology and design issues so that the reader will understand the implications of the semiconductor industry's next substantial milestone - gigascale integration.