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Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys (R). Softcover reprint of the original 1st ed. 2003
・ISBN 978-1-4613-4989-1 paper EUR 169.99
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| 著者・編者 | Madenci, Erdogan / Guven, Ibrahim / Kilic, Bahattin, |
|---|---|
| シリーズ | (The Springer International Series in Engineering and Computer Science) |
| 出版社 | (Springer-Verlag New York Inc., US) |
| 出版年月 | 2012 |
| ページ数 | 185 pp. |
| 言語 | ENG |
| ニュース番号 | ＜A04-78110＞ |
解説
Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS (R) describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS (R) that is designed for solder joint fatigue reliability analysis of electronic packages. Specific steps of the analysis method are discussed through examples without leaving any room for confusion. The add-on package along with the examples make it possible for an engineer with a working knowledge of ANSYS (R) to perform solder joint reliability analysis.
Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS (R) allows the engineers to conduct fatigue reliability analysis of solder joints in electronic packages.
Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS (R) allows the engineers to conduct fatigue reliability analysis of solder joints in electronic packages.