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商品詳細
Advanced Flip Chip Packaging. Softcover reprint of the original 1st ed. 2013
・ISBN 978-1-4899-7933-9 paper EUR 149.52
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お気に入り
★★★
| 著者・編者 | Tong, Ho-Ming / Lai, Yi-Shao / Wong, C.P. (eds.), |
|---|---|
| 出版社 | (Springer-Verlag New York Inc., US) |
| 出版年月 | 2016 |
| ページ数 | 560 pp. |
| 言語 | ENG |
| ニュース番号 | ＜A04-62473＞ |
解説
Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.