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Recent Trends in VLSI and Semiconductor Packaging.
・ISBN 978-1-041-01786-8 hard GB£ 187.99
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| 著者・編者 | Reddy, T. Vasudeva / Rao, K. Madhava (eds.), |
|---|---|
| 出版社 | (CRC Press, UK) |
| 出版年月 | 2025 |
| ページ数 | 616 pp. |
| 言語 | ENG |
| ニュース番号 | ＜A03-87363＞ |
解説
The International conference on Semiconductor Materials packaging, AI&ML, Reconfigurable VLSI architectures for IoT, future Communication Technologies ("SMART-2024") aimed to provide a platform for researchers, academicians, industry experts, and practitioners to exchange ideas, present research findings, and discuss emerging trends and challenges in the specified fields. "SMART-2024" seeked to foster collaboration, innovation, and knowledge dissemination by bringing together experts and stakeholders from diverse backgrounds to address key issues and explore new research directions. The conference targeted a diverse audience including researchers, academicians, scientists, engineers, technologists, industry professionals, students, policymakers, and other stakeholders interested in VLSI, IoT, AI-ML, communication systems, semiconductor packaging, hetero architecture devices, and Nano materials.