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商品詳細
3D Stacked Chips: From Emerging Processes to Heterogeneous Systems. Softcover reprint of the original 1st ed. 2016
・ISBN 978-3-319-79305-4 paper EUR 49.99
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お気に入り
★★★
| 著者・編者 | Elfadel, Ibrahim (Abe) M. / Fettweis, Gerhard (eds.), |
|---|---|
| 出版社 | (Springer International Publishing AG, SZ) |
| 出版年月 | 2018 |
| ページ数 | 339 pp. |
| 言語 | ENG |
| ニュース番号 | ＜A02-90723＞ |
解説
This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems.