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商品詳細
RF and Microwave Microelectronics Packaging II. Softcover reprint of the original 1st ed. 2017
・ISBN 978-3-319-84719-1 paper EUR 84.99
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| 著者・編者 | Kuang, Ken / Sturdivant, Rick (eds.), |
|---|---|
| 出版社 | (Springer International Publishing AG, SZ) |
| 出版年月 | 2018 |
| ページ数 | 172 pp. |
| 言語 | ENG |
| ニュース番号 | ＜A02-90126＞ |
解説
This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to "RF and Microwave Microelectronics Packaging" (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.