株式会社極東書店トップ商品一覧New Prospects of Integrating Low Substrate Temperatures with Scaling-Sustained Device Architectural Innovation.

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New Prospects of Integrating Low Substrate Temperatures with Scaling-Sustained Device Architectural Innovation.

New Prospects of Integrating Low Substrate Temperatures with Scaling-Sustained Device Architectural Innovation.

・ISBN 978-3-031-00899-3 paper EUR 27.99

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お気に入り
著者・編者Ashraf, Nabil Shovon / Alam, Shawon / Alam, Mohaiminul,
シリーズ (Synthesis Lectures on Emerging Engineering Technologies)
出版社 (Springer International Publishing AG, SZ)
出版年月2016
ページ数72 pp.
言語ENG
ニュース番号<A02-80038>

解説

In order to sustain Moore's Law-based device scaling, principal attention has focused on toward device architectural innovations for improved device performance as per ITRS projections for technology nodes up to 10 nm. Efficient integration of lower substrate temperatures (