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Three-Dimensional Integration and Modeling: A Revolution in RF and Wireless Packaging.
・ISBN 978-3-031-00575-6 paper EUR 32.99
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| 著者・編者 | Lee, Jong-Hoon / Tentzeris, Manos M., |
|---|---|
| シリーズ | (Synthesis Lectures on Computational Electromagnetics) |
| 出版社 | (Springer International Publishing AG, SZ) |
| 出版年月 | 2007 |
| ページ数 | 108 pp. |
| 言語 | ENG |
| ニュース番号 | ＜A02-79897＞ |
解説
This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band transceiver front-end midule demonstrate the revolutionary effects of this approach in RF/Wireless packaging and multifunctional miniaturization. Designs covered are based on novel ideas and are presented for the first time for millimeterwave (60GHz) ultrabroadband wireless modules. Table of Contents: Introduction / Background on Technologies for Millimeter-Wave Passive Front-Ends / Three-Dimensional Packaging in Multilayer Organic Substrates / Microstrip-Type Integrated Passives / Cavity-Type Integrated Passives / Three-Dimensional Antenna Architectures / Fully Integrated Three-Dimensional Passive Front-Ends / References