株式会社極東書店トップ ＞ 商品一覧 ＞ Three-Dimensional Integration of Semiconductors: Processing, Materials, and Applications. Softcover reprint of the original 1st ed. 2015
商品詳細
Three-Dimensional Integration of Semiconductors: Processing, Materials, and Applications. Softcover reprint of the original 1st ed. 2015
・ISBN 978-3-319-79255-2 paper EUR 149.99
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お気に入り
★★★
| 著者・編者 | Kondo, Kazuo / Kada, Morihiro / Takahashi, Kenji (eds.), |
|---|---|
| 出版社 | (Springer International Publishing AG, SZ) |
| 出版年月 | 2019 |
| ページ数 | 408 pp. |
| 言語 | ENG |
| ニュース番号 | ＜A02-55704＞ |
解説
This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book covers numerous applications, including next generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others. The book concludes with recent progress and developments in three dimensional packaging, as well as future prospects.