株式会社極東書店トップ ＞ 商品一覧 ＞ Recent Progress in Lead-Free Solder Technology: Materials Development, Processing and Performances. 2022 ed.
商品詳細
Recent Progress in Lead-Free Solder Technology: Materials Development, Processing and Performances. 2022 ed.
・ISBN 978-3-030-93443-9 paper EUR 169.99
￥45,437.- (税込) ※（※）価格はご注文時の参考価格となります。
納品価格につきましては書籍の入荷時点で確定となります。
版元の原価改定、外国為替の変動等により異なる場合がございますので、予めご了承下さい。
お気に入り
★★★
| 著者・編者 | Salleh, Mohd Arif Anuar Mohd / Abdul Aziz, Mohd Sharizal / Jalar, Azman / Izwan Ramli, Mohd Izrul (eds.), |
|---|---|
| シリーズ | (Topics in Mining, Metallurgy and Materials Engineering) |
| 出版社 | (Springer Nature Switzerland AG, SZ) |
| 出版年月 | 2023 |
| ページ数 | 328 pp. |
| 言語 | ENG |
| ニュース番号 | ＜A02-51943＞ |
解説
This book highlights recent research progress in lead (Pb)-free solder technology, focusing on materials development, processing, and performances. It discusses various Pb-free solder materials' development, encompassing composite solders, transient liquid phase sintering, and alloying. The book also details various Pb-free solder technology processing and performances, including flux modification for soldering, laser soldering, wave soldering, and reflow soldering, while also examining multiple technologies pertaining to the rigid and flexible printed circuit board (PCB). Some chapters explain the materials characterization and modeling techniques using computational fluid dynamics (CFD). This book serves as a valuable reference for researchers, industries, and stakeholders in advanced microelectronic packaging, emerging interconnection technology, and those working on Pb-free solder.