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More-than-Moore Devices and Integration for Semiconductors. 2023 ed.

More-than-Moore Devices and Integration for Semiconductors. 2023 ed.

・ISBN 978-3-031-21612-1 paper EUR 59.99

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お気に入り
著者・編者Iacopi, Francesca / Balestra, Francis (eds.),
出版社 (Springer International Publishing AG, SZ)
出版年月2024
ページ数260 pp.
言語ENG
ニュース番号<A02-27540>

解説

This book provides readers with a comprehensive, state-of-the-art reference for miniaturized More-than-Moore systems with a broad range of functionalities that can be added to 3D microsystems, including flexible electronics, metasurfaces and power sources. The book also includes examples of applications for brain-computer interfaces and event-driven imaging systems.

  • Provides a comprehensive, state-of-the-art reference for miniaturized More-than-Moore systems;
  • Covers functionalities to add to 3D microsystems, including flexible electronics, metasurfaces and power sources;
  • Includes current applications, such as brain-computer interfaces, event - driven imaging and edge computing.