株式会社極東書店トップ ＞ 商品一覧 ＞ Through Silicon Vias: Materials, Models, Design, and Performance.
商品詳細
Through Silicon Vias: Materials, Models, Design, and Performance.
・ISBN 978-0-367-57454-3 paper GB£ 54.99
￥17,420.- (税込) ※（※）価格はご注文時の参考価格となります。
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| 著者・編者 | Kaushik, Brajesh Kumar / Ramesh Kumar, Vobulapuram / Majumder, Manoj Kumar / Alam, Arsalan, |
|---|---|
| 出版社 | (CRC Press, UK) |
| 出版年月 | 2020 |
| ページ数 | 216 pp. |
| 言語 | ENG |
| ニュース番号 | ＜A00-46251＞ |
解説
Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and physical configurations, different electrical equivalent models for Cu, carbon nanotube (CNT) and graphene nanoribbon (GNR) based TSVs are presented. Based on the electrical equivalent models the performance comparison among the Cu, CNT and GNR based TSVs are also discussed.