株式会社極東書店トップ商品一覧Handbook of Semiconductor Interconnection Technology. 2nd edition

商品詳細

Handbook of Semiconductor Interconnection Technology. 2nd edition

Handbook of Semiconductor Interconnection Technology. 2nd edition

・ISBN 978-1-57444-674-6 hard GB£ 260.00

¥82,368.- (税込) (※)価格はご注文時の参考価格となります。
納品価格につきましては書籍の入荷時点で確定となります。
版元の原価改定、外国為替の変動等により異なる場合がございますので、予めご了承下さい。

お気に入り
電子版あり 大学・学術機関向け電子ブック(eBook)ISBN 9780429136139
著者・編者Shwartz, Geraldine Cogin / Schwartz, Geraldine C. / Srikrishnan, Kris V. (eds.),
出版社 (CRC Press Inc, US)
出版年月2006
ページ数536 pp.
言語ENG
ニュース番号<A00-25427>

解説

First introduced about a decade ago, the first edition of the Handbook of Semiconductor Interconnection Technology became widely popular for its thorough, integrated treatment of interconnect technologies and its forward-looking perspective. The field has grown tremendously in the interim and many of the "likely directions" outlined in the first edition are now standard in modern facilities. Reflecting those advances, this edition delves into the practical aspects of interconnections for manufacturing. It examines the interconnect and fabrication technologies now available, with an examination of future prospects for the field.

What's in this Edition:

  • Detailed discussion of electrochemical equipment for plating copper
  • Information on tools used for evaporation, chemical vapor deposition, and plasma processes
  • Emphasis on measurement of mechanical and thermal properties of insulators
  • Methods for characterizing porous dielectric thin films
  • Greater focus on integration issues and properties of titanium, cobalt, and nickel silicides
  • Process schemes based on the increased need for borderless contact gates and source/drain
  • Expanded discussion on choices for low-dielectric insulators
  • Concentration on electroplated copper, especially morphology of plated films and their properties
  • Developments in thin film liners and barriers
  • Expanded material on copper reliability